TY - GEN
T1 - Low temperature and low pressure bump bonding realized by single-micrometer Ag-nanoparticle bumps
AU - Fu, Weixin
AU - Kasahara, Takashi
AU - Okada, Akiko
AU - Shoji, Shuichi
AU - Shigetou, Akitsu
AU - Mizuno, Jun
PY - 2014
Y1 - 2014
N2 - A bonding method using single-micrometer bumps, which were formed by Ag nanoparticle, had been realized under low bonding temperature and low compressive stress. The bump diameter is 8 μm and the pitch is 16 μm. The bonding temperature was 250 °C under compressive stress of about 41.4 MPa. A shear test was carried out and the strength of the bond could reach 5.89 MPa.
AB - A bonding method using single-micrometer bumps, which were formed by Ag nanoparticle, had been realized under low bonding temperature and low compressive stress. The bump diameter is 8 μm and the pitch is 16 μm. The bonding temperature was 250 °C under compressive stress of about 41.4 MPa. A shear test was carried out and the strength of the bond could reach 5.89 MPa.
UR - http://www.scopus.com/inward/record.url?scp=84906984041&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84906984041&partnerID=8YFLogxK
U2 - 10.1109/LTB-3D.2014.6886186
DO - 10.1109/LTB-3D.2014.6886186
M3 - Conference contribution
AN - SCOPUS:84906984041
SN - 9781479952618
T3 - Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
SP - 47
BT - Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
PB - IEEE Computer Society
T2 - 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Y2 - 15 July 2014 through 16 July 2014
ER -