Low temperature Au-Au bonding with VUV/O 3 treatment

Akiko Okada, Masatsugu Nimura, Naoko Unami, Akitsu Shigetou, Hirokazu Noma, Katsuyuki Sakuma, Jun Mizuno, Shuichi Shoji

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

This paper describes low temperature Au-Au bonding with vacuum ultraviolet (VUV) irradiation in the presence of oxygen gas. The VUV/O 3 treatment can remove organic contaminants of Au surfaces without damages. The Au surfaces after the VUV/O 3 treatment were analyzed by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). The results show that carbon-based contaminants were dramatically decreased and that there were no serious damages in Au surfaces by the VUV/O 3 treatment. The Au-Au bonding with VUV/O 3 treatment was achieved at 200 °C. The average of shear strength of about 80 MPa per unit area was obtained. Therefore, it was proved that VUV/O 3 treatment is effective in Au-Au bonding.

原文English
主出版物標題2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
DOIs
出版狀態Published - 2011
事件2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka, Japan
持續時間: 2012 1月 312012 2月 2

出版系列

名字2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Conference

Conference2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
國家/地區Japan
城市Osaka
期間12-01-3112-02-02

All Science Journal Classification (ASJC) codes

  • 控制與系統工程

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