Low temperature growth and structural characterization of nanocrystalline silicon films

Te Chi Wong, Chi Chung Yu, Jih Jen Wu

研究成果: Article同行評審

9 引文 斯高帕斯(Scopus)

摘要

Growth of nanocrystalline silicon films at substrate temperatures below 210°C using SiCl4/H2 in a hot-wire chemical vapor deposition (HW-CVD) reactor is reported here. Raman spectroscopy, X-ray diffraction (XRD) and transmission electron microscopy (TEM) were employed to investigate the microstructure of the silicon films. TEM analyses reveal that nanocrystalline silicon film with grain sizes in a range 7-10nm was deposited at a substrate temperature of 150°C. A 45-nm-thick amorphous interfacial layer was formed on the glass substrate prior to the nanocrystalline film. Raman scattering measurement determines that the deposition of nanocrystalline silicon film with a 90% crystalline fraction is achieved at 150°C. A nanocrystalline film with a 77% crystalline fraction is formed at a substrate temperature of 90°C. The advantages of this process and roles of Cl and H radicals in the formation of crystalline silicon films are discussed.

原文English
頁(從 - 到)419-426
頁數8
期刊Journal of Crystal Growth
243
發行號3-4
DOIs
出版狀態Published - 2002 九月

All Science Journal Classification (ASJC) codes

  • 凝聚態物理學
  • 無機化學
  • 材料化學

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