Manufacturing and materials properties of Ti/Cu/Electroless Ni/Solder bump on Si

Kwang Lung Lin, Kun Tzu Hsu

研究成果: Article同行評審

12 引文 斯高帕斯(Scopus)

摘要

This work attempted to fabricate the solder bump of the structure: Si/Ti/Cu/Electroless Ni/Solder. The shearing strength of the solder bump, with bump pad of 60 μm in diameter, is around 15 g/bump prior to and after reflow. The solder bumps fractured at the solder. Humidity test at 85% of relative humidity at 85°C and a high temperature treatment at 150°C for 1000 h tend to downgrade the shearing strength of the solder portion of the bump, yet not the interface. Both treatments enhance the growth of intermetallic compound (IMC) formed between Ni and solder. The barrier effect of electroless nickel deposit was investigated.

原文English
頁(從 - 到)657-660
頁數4
期刊IEEE Transactions on Components and Packaging Technologies
23
發行號4
DOIs
出版狀態Published - 2000 十二月

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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