Mechanical and Interfacial Properties Characterization of Physical Vapor Deposited Metallic Films after Rapid Thermal Annealing for Packaging Applications

Engineering & Materials Science

• Adhesion 27%
• Aluminum 23%
• Characterization (materials science) 52%
• Deposition rates 38%
• Elastic moduli 25%
• Hardness 23%
• Integrated circuits 27%
• Mechanical properties 38%
• Metallic films 100%
• Nanoindentation 36%
• Packaging 53%
• Rapid thermal annealing 91%
• Rapid thermal processing 47%
• Residual stresses 51%
• Silicon wafers 36%
• Stress analysis 30%
• Structural design 29%
• Structural integrity 31%
• Temperature 11%
• Vapors 53%

Chemical Compounds

• Dielectric Material 26%
• Liquid Film 28%
• Rapid Thermal Annealing 89%
• Residual Stress 79%
• Strength 19%