Mechanical characterization of atomic layer deposited (ALD) alumina for applications in corrosive environments

Kuang Shun Ou, I. Kuan Lin, Ping Hsing Wu, Zhi Kai Huang, Kuo Shen Chen, Xin Zhang

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

摘要

In this work, thin ALD alumina films were fabricated for evaluating their capabilities as a barrier material for corrosive environments. The fracture toughness and the corrosion-resisting properties after fatigue cycle of these thin ALD alumina films have been characterized. Indentation tests indicate that the ALD alumina/Al structures could enhance both the yield strength of the metal and the effective fracture toughness of the coated ALD alumina films and this result could be useful for designing nanocomposite structures. However, the test results also indicate that the interfacial strength of the ALD/A1 structures was prone to degrade under fatigue loading under corrosive environment. This could potentially be a problem for the long term reliability of related devices operated under a harsh environment. In addition, the strong correlation between indentation behavior and fatigue loading for the structure indicate that nanoindentation response could be possibly used to indicate the damage level of microstructures for future reliability evaluations.

原文English
主出版物標題Microelectromechanical Systems - Materials and Devices III
頁面111-116
頁數6
出版狀態Published - 2010 八月 30
事件2009 MRS Fall Meeting - Boston, MA, United States
持續時間: 2009 十一月 302009 十二月 4

出版系列

名字Materials Research Society Symposium Proceedings
1222
ISSN(列印)0272-9172

Other

Other2009 MRS Fall Meeting
國家United States
城市Boston, MA
期間09-11-3009-12-04

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • 引用此

    Ou, K. S., Lin, I. K., Wu, P. H., Huang, Z. K., Chen, K. S., & Zhang, X. (2010). Mechanical characterization of atomic layer deposited (ALD) alumina for applications in corrosive environments. 於 Microelectromechanical Systems - Materials and Devices III (頁 111-116). (Materials Research Society Symposium Proceedings; 卷 1222).