Mechanical properties characterization of PECVD nitride films with rapid thermal annealing using finite element simulation

Chih Yang Chiang, Hong Yi Yan, Zhi Kai Huang, Kuo Shen Chen

研究成果: Conference contribution

摘要

This paper presents the development of a new model for extracting elastic modulus from nanoindentation testing data and its subsequent application for deterimining the Young's modulus of plasma-enhanced chemical vapour deposited (PECVD) silicon nitride films after rapid thermal annealing (RTA), processed between 400 and 800°C. Primary test data indicate that the modulus varied significantly with different RTA temperatures. However, the traditional data reduction scheme cannot exclude the substrate effect and it results in depth-dependent modulus. In this work, the substrate effect can be significantly reduced by the proposed model and the accurate data reduction implies that it is possible to provide more understanding to accurate correlate the fabrication process parameters and the resulted mechanical behavior of thin films in the future.

原文English
主出版物標題Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011
頁面20-23
頁數4
出版狀態Published - 2011 十一月 23
事件Nanotechnology 2011: Advanced Materials, CNTs, Particles, Films and Composites - 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011 - Boston, MA, United States
持續時間: 2011 六月 132011 六月 16

出版系列

名字Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011
1

Other

OtherNanotechnology 2011: Advanced Materials, CNTs, Particles, Films and Composites - 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011
國家United States
城市Boston, MA
期間11-06-1311-06-16

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

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  • 引用此

    Chiang, C. Y., Yan, H. Y., Huang, Z. K., & Chen, K. S. (2011). Mechanical properties characterization of PECVD nitride films with rapid thermal annealing using finite element simulation. 於 Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011 (頁 20-23). (Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011; 卷 1).