Mechanical properties characterization of PECVD nitride films with rapid thermal annealing using finite element simulation

Engineering & Materials Science

• Rapid thermal annealing 100%
• Nitrides 78%
• Data reduction 76%
• Plasmas 59%
• Vapors 58%
• Characterization (materials science) 56%
• Elastic moduli 54%
• Substrates 45%
• Mechanical properties 42%
• Silicon nitride 39%
• Nanoindentation 39%
• Thin films 30%
• Testing 16%
• Temperature 13%

Physics & Astronomy

• data reduction 78%
• nitrides 60%
• modulus of elasticity 52%
• vapors 49%
• mechanical properties 43%
• annealing 39%
• characterization 36%
• nanoindentation 32%
• silicon nitrides 31%
• simulation 24%
• fabrication 19%
• thin films 16%
• temperature 9%

Chemical Compounds

• Rapid Thermal Annealing 96%
• Nitride 62%
• Simulation 41%
• Young's Modulus 34%
• Liquid Film 31%
• Reduction 29%