TY - GEN
T1 - Mechanical properties of Sn-Bi-Ag low-temperature Pb-free solders
AU - Yang, Chih Han
AU - Liu, Yu Chen
AU - Hirata, Yuki
AU - Nishikawa, Hiroshi
AU - Lin, Shih Kang
N1 - Funding Information:
ACKNOWLEDGMENT The authors gratefully acknowledge the financial supports from the Ministry of Science and Technology (MOST) in Taiwan (109-3111-8-006-001, 110-2622-8-006-017-SB, 110-2636-E-006-016 and 110-2222-E-006-008). This work was also partially supported by the Hierarchical Green-Energy Materials (Hi-GEM) Research Center, from The Featured Areas Research Center Program within the framework of the
Funding Information:
Higher Education Sprout Project by the Ministry of Education (MOE) and MOST (110-2634-F-006 -017) in Taiwan.
Publisher Copyright:
© 2022 Japan Institute of Electronics Packaging.
PY - 2022
Y1 - 2022
N2 - We designed low-temperature tin-bismuth-silver (Sn-Bi-Ag, SBA) solder by CALculation of PHAse Diagram (CALPHAD)-type thermodynamic calculations using the PANDAT software and performed corresponding key experiments. The goal is to suppress bismuth (Bi)-rich phase width growth, while keeping their low melting temperatures. This study shows that CALPHAD calculations make a good agreement with experimental results in phase fraction, melting point, and paths of solidification. As for the tensile properties of the SBA solder in as-cast, high yield strength (YS), high ultimate tensile strength (UTS), and slightly better elongation than the conventional Sn-58Bi solder were obtained. After being thermally aged, higher strength and same elongation level of Sn-58Bi were observed.
AB - We designed low-temperature tin-bismuth-silver (Sn-Bi-Ag, SBA) solder by CALculation of PHAse Diagram (CALPHAD)-type thermodynamic calculations using the PANDAT software and performed corresponding key experiments. The goal is to suppress bismuth (Bi)-rich phase width growth, while keeping their low melting temperatures. This study shows that CALPHAD calculations make a good agreement with experimental results in phase fraction, melting point, and paths of solidification. As for the tensile properties of the SBA solder in as-cast, high yield strength (YS), high ultimate tensile strength (UTS), and slightly better elongation than the conventional Sn-58Bi solder were obtained. After being thermally aged, higher strength and same elongation level of Sn-58Bi were observed.
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U2 - 10.23919/ICEP55381.2022.9795572
DO - 10.23919/ICEP55381.2022.9795572
M3 - Conference contribution
AN - SCOPUS:85133381192
T3 - 2022 International Conference on Electronics Packaging, ICEP 2022
SP - 37
EP - 38
BT - 2022 International Conference on Electronics Packaging, ICEP 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st International Conference on Electronics Packaging, ICEP 2022
Y2 - 11 May 2022 through 14 May 2022
ER -