TY - JOUR
T1 - Mechanical Strength of Sn-3.5Ag-Based Solders and Related Bondings
AU - Chuang, Chiang Ming
AU - Shih, Po Cheng
AU - Lin, Kwang Lung
N1 - Funding Information:
The financial support of this work from the National Science Council of the Republic of China (Taiwan) under Grant No. NSC91-2216-E-006-035 is gratefully acknowledged. The authors also thank Accurus Inc. for supplying the solder balls.
Copyright:
Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2004/1/2
Y1 - 2004/1/2
N2 - The tensile strengths of bulk solders and joint couples of Sn-3.5Ag-0.5Cu, Sn-3.5Ag-0.07Ni, and Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge solders and the shear strengths of ball grid array (BGA) specimens, solder-ball-attached Cu/Ni/Au metallized substrates were investigated. The tensile strength of the bulk is degraded by thermal aging. The Ni-containing solder exhibits lower tensile strength than Sn-3.5Ag-0.5Cu after thermal aging. However, the Ni-containing solder joints show greater tensile strength than the Cu/Sn-3.5Ag-0.5Cu/Cu joint. Fracture of the solder joint occurs between the intermetallic compound (IMC) and the solder. The shear strength and fracture mechanism of BGA specimens are the same regardless of solder composition.
AB - The tensile strengths of bulk solders and joint couples of Sn-3.5Ag-0.5Cu, Sn-3.5Ag-0.07Ni, and Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge solders and the shear strengths of ball grid array (BGA) specimens, solder-ball-attached Cu/Ni/Au metallized substrates were investigated. The tensile strength of the bulk is degraded by thermal aging. The Ni-containing solder exhibits lower tensile strength than Sn-3.5Ag-0.5Cu after thermal aging. However, the Ni-containing solder joints show greater tensile strength than the Cu/Sn-3.5Ag-0.5Cu/Cu joint. Fracture of the solder joint occurs between the intermetallic compound (IMC) and the solder. The shear strength and fracture mechanism of BGA specimens are the same regardless of solder composition.
UR - https://www.scopus.com/pages/publications/0742303045
UR - https://www.scopus.com/pages/publications/0742303045#tab=citedBy
U2 - 10.1007/s11664-004-0286-4
DO - 10.1007/s11664-004-0286-4
M3 - Article
AN - SCOPUS:0742303045
SN - 0361-5235
VL - 33
SP - 1
EP - 6
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
IS - 1
ER -