TY - JOUR
T1 - Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill
AU - Wu, Kuo Tsai
AU - Hwang, Sheng Jye
AU - Lee, Huei Huang
N1 - Publisher Copyright:
© 2017, The Minerals, Metals & Materials Society.
PY - 2017/8/1
Y1 - 2017/8/1
N2 - Voids have always been present using the molded underfill (MUF) package process, which is a problem that needs further investigation. In this study, the process was studied using the Moldex3D numerical analysis software. The effects of gas (air vent effect) on the overall melt front were also considered. In this isothermal process containing two fluids, the gas and melt colloid interact in the mold cavity. Simulation enabled an appropriate understanding of the actual situation to be gained, and, through analysis, the void region and exact location of voids were predicted. First, the global flow end area was observed to predict the void movement trend, and then the local flow ends were observed to predict the location and size of voids. In the MUF 518 case study, simulations predicted the void region as well as the location and size of the voids. The void phenomenon in a flip chip ball grid array underfill is discussed as part of the study.
AB - Voids have always been present using the molded underfill (MUF) package process, which is a problem that needs further investigation. In this study, the process was studied using the Moldex3D numerical analysis software. The effects of gas (air vent effect) on the overall melt front were also considered. In this isothermal process containing two fluids, the gas and melt colloid interact in the mold cavity. Simulation enabled an appropriate understanding of the actual situation to be gained, and, through analysis, the void region and exact location of voids were predicted. First, the global flow end area was observed to predict the void movement trend, and then the local flow ends were observed to predict the location and size of voids. In the MUF 518 case study, simulations predicted the void region as well as the location and size of the voids. The void phenomenon in a flip chip ball grid array underfill is discussed as part of the study.
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U2 - 10.1007/s11664-017-5516-7
DO - 10.1007/s11664-017-5516-7
M3 - Article
AN - SCOPUS:85018528747
SN - 0361-5235
VL - 46
SP - 5094
EP - 5106
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
IS - 8
ER -