Memory repair by die stacking with through silicon vias

Yung Fa Chou, Ding Ming Kwai, Cheng Wen Wu

研究成果: Conference contribution

11 引文 斯高帕斯(Scopus)

指紋

深入研究「Memory repair by die stacking with through silicon vias」主題。共同形成了獨特的指紋。

Mathematics

Engineering & Materials Science