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MEMS residual stress characterization: Methodology and perspective
Kuo Shen Chen
, Kuang Shun Ou
機械工程學系
研究成果
:
Chapter
5
引文 斯高帕斯（Scopus）
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深入研究「MEMS residual stress characterization: Methodology and perspective」主題。共同形成了獨特的指紋。
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Keyphrases
Residual Stress
100%
Micro-electro-mechanical Systems
100%
Characterization Techniques
100%
Stress Characterization
100%
System Structure
37%
Material Properties
25%
Material Level
25%
Curvature Measurement
25%
Measurement Method
12%
Temperature Strain
12%
Carrier Concentration
12%
Material Mechanical Properties
12%
Young's Modulus
12%
Raman Spectroscopy
12%
Crystal Orientation
12%
Compressive Stress
12%
Frequency Energy
12%
Fracture Strength
12%
Stress Level
12%
Diaphragm
12%
Microhardness
12%
Film Growth
12%
Micromechanics
12%
Stress State
12%
Electrostatic Actuation
12%
Fracture Toughness
12%
Mechanical Components
12%
Residual Stress Measurement
12%
Non-destructive Measurement
12%
Beam Structure
12%
Structural Integrity
12%
Electron-phonon Interaction
12%
Indentation Test
12%
Nonlinear Stability
12%
Plate Structure
12%
Mechanical Strain
12%
Wafer Level
12%
Stress Measurement
12%
Stress Gradient
12%
Material Composition
12%
Dynamical Characteristics
12%
Structural Longevity
12%
Phonon Frequencies
12%
Reliability Characteristics
12%
Thin Film Stress
12%
Destructive Measurement
12%
Material Component
12%
Bulge Test
12%
Electron States
12%
Fixed Beam
12%
Buckling Collapse
12%
M-test
12%
Measurement Residuals
12%
Impurity Content
12%
Thin Film Properties
12%
Varying Dimension
12%
Material Yielding
12%
Structure Level
12%
Engineering
Microelectromechanical System
100%
Residual Stress
100%
System Structure
37%
Thin Films
25%
Fracture Strength
25%
Material Level
25%
Carrier Concentration
12%
Indentation
12%
Young's Modulus
12%
Crystal Orientation
12%
Compressive Stress
12%
Microhardness
12%
Stress Level
12%
Diaphragm
12%
Test Method
12%
Crystal Structure
12%
Electrostatic Actuation
12%
Mechanical Component
12%
Stress Gradient
12%
Structural Integrity
12%
Plate Structure
12%
Mechanical Strain
12%
Test Structure
12%
Material Component
12%
Material Composition
12%
Phonon Interaction
12%
Bulge Test
12%
Film Growth Process
12%
Fixed Beam
12%
Impurity Content
12%
Residual Stress Measurement
12%
Material Science
Residual Stress
100%
Microelectromechanical System
100%
Thin Films
22%
Materials Property
22%
Fracture Toughness
22%
Stress Measurement
22%
Carrier Concentration
11%
Crystal Structure
11%
Indentation
11%
Young's Modulus
11%
Raman Spectroscopy
11%
Crystal Orientation
11%
Microhardness
11%
Film Growth
11%