Metal contact printing photolithography for fabricating sub-micrometer patterned sapphire substrates in light-emitting diodes

Yi Ta Hsieh, Yung Chun Lee

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

摘要

This paper reports a novel process which is combine the contact metal transfer method and traditional photolithography process for fabricate nano-scale pattern sapphire substrate (NPSS) used in high brightness light emitting diodes (LEDs). The novel process can directly transfer a metal pattern onto the PR layer which above the sapphire substrate, the transferred metal pattern can as a perfect photo-mask for subsequent photolithography process. In this work, the high aspect ratio PR structures with the aspect ratio of 5 and line width of 500 nm are created by this novel process. Furthermore, the PR structure can as a etching mask for inductively coupled plasma (ICP) etching on the sapphire substrate. During the ICP etching, we successfully to obtain the NPSS with a perfect cone shape. Experiments have been demonstrate the feasibility of using this new approach for obtaining sub-micrometer surface structures on the complete surface area of a 2 inch and 4 inch sapphire substrates.

原文English
主出版物標題2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
頁面40-44
頁數5
DOIs
出版狀態Published - 2012
事件7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 - Kyoto, Japan
持續時間: 2012 3月 52012 3月 8

出版系列

名字2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012

Other

Other7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
國家/地區Japan
城市Kyoto
期間12-03-0512-03-08

All Science Journal Classification (ASJC) codes

  • 工程(雜項)

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