Metallographic Mechanism of Embrittlement of 15 μm Ultrafine Quaternary Silver Alloy Bonding Wire in Chloride Ions Environment

Physics & Astronomy

• silver alloys 86%
• quaternary alloys 83%
• embrittlement 72%
• chlorides 62%
• wire 46%
• chlorination 30%
• ions 29%
• elongation 19%
• platinum alloys 15%
• electronic packaging 14%
• gold alloys 14%
• ion microscopes 14%
• aluminum 14%
• sodium chlorides 12%
• sealing 12%
• palladium 11%
• corrosion 9%
• intermetallics 9%
• industries 8%
• silver 8%
• electron microscopes 8%
• cracks 7%
• grain boundaries 7%
• scanning 6%
• causes 6%
• cross sections 6%

Engineering & Materials Science

• Silver alloys 100%
• Embrittlement 74%
• Ions 57%
• Wire 46%
• Chlorination 31%
• Ion microscopes 20%
• Elongation 19%
• Platinum alloys 18%
• Gold alloys 16%
• Aluminum 16%
• Substrates 14%
• Galvanic corrosion 14%
• Palladium 13%
• Electronics packaging 13%
• Silver 11%
• Intermetallics 10%
• Sodium chloride 10%
• Grain boundaries 10%
• Electron microscopes 9%
• Scanning 8%
• Cracks 7%
• Industry 4%
• Experiments 3%

Chemical Compounds

• Silver Alloy 98%
• Embrittlement 82%
• Environment 35%
• Strength 26%
• Intermetallic Compound 22%
• Grain Boundary 21%
• Sodium Chloride 19%
• Industry 15%
• Alloy 14%
• Chloride 12%
• Electron Particle 11%
• Ion 8%
• Time 7%
• Surface 6%