Micropressure sensor fabrication without problem of stiction for a wider range of measurement

H. S. Ko, C. W. Liu, Chie Gau

研究成果: Article

11 引文 斯高帕斯(Scopus)


The objective of this paper is to present a novel fabrication process for one or arrays of micropressure sensors. The fabrication process is almost the reverse of the surface micromachining process used for the pressure sensor. This allows the use of SU-8 to form cavity that can be much deeper for pressure measurement. Thus, the sensor made can provide a much wider range of pressure measurement. The fabrication process allows arrays of pressure sensors integrated into a complicated microchannel system for detailed pressure flow measurements. The fabrication process has completely absence of diaphragm stiction. Theoretical analysis for the stress and deformation of the pressure sensor diaphragm is derived and used for diaphragm design calculation. More detailed design and fabrication techniques developed for this sensor is presented.

頁(從 - 到)261-267
期刊Sensors and Actuators, A: Physical
出版狀態Published - 2007 七月 20

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering

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