Microstructural evolution of Sn-3.5Ag solder with lanthanum addition

Hwa Teng Lee, Yin Fa Chen, Ting Fu Hong, Ku Ta Shih, Che Wei Hsu

研究成果: Conference contribution

摘要

The goal of this research is to evaluate the effects of La addition on the microstructure and microhardness of Sn-Ag based solders. Sn-3.5Ag-xLa ternary alloy solders were prepared by adding 0-1.0wt% La into a Sn-3.5Ag alloy. Copper substrates were then dipped into these solders and aged at 150°C for up to 625 hours. The microstructure and microhardness of the as solidified solder and the aged solder/copper couples were investigated. Experimental results show that Sn-3.5Ag-xLa solders are composed of β-Sn, Ag3Sn, and LaSn 3 phases, and that their microstructure is refined with La addition. After isothermal storage, the Ag3Sn and IMC layer can be effectively depressed by adding a small amount of La element, and the size and amount of LaSn3 compounds does not change perceptibly with storage time. For as-cast solder, the addition of La increased the microhardness of the Sn-Ag solder due to the refining effect of Ag3Sn particles in the eutectic zone and increased formation of LaSn3 compound. After isothermal storage, the microhardness of solders was decreased with the increasing coarsening of Ag3Sn compounds as aging time was increased. However, coarsening of Ag3Sn compounds was retarded by La addition. Therefore, La addition helped to improve the microhardness and thermal resistance of the solder joints.

原文English
主出版物標題2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
頁面617-622
頁數6
DOIs
出版狀態Published - 2009
事件2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 - Beijing, China
持續時間: 2009 八月 102009 八月 13

出版系列

名字2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Other

Other2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
國家/地區China
城市Beijing
期間09-08-1009-08-13

All Science Journal Classification (ASJC) codes

  • 電氣與電子工程

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