Microstructural features and vibration fracture behavior of Sn-Zn-Ag solder alloys

J. M. Song, G. F. Lan, Truan-Sheng Lui, L. H. Chen

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

摘要

Mechanical properties of a potential lead-free solder, Sn-9Zn-xAg (x=0.5∼3.5 wt%), are examined in this study, particularly the vibration fatigue behavior. Results show that striated deformation of Sn-rich dendrites contributes to a greater damping capacity and thus the specimens with higher Ag content possessed a higher vibration life when suffering vibration with a constant vibration force. With respect to vibration under a fixed initial deflection amplitude, all the specimens had a similar vibration fracture resistance under low strain amplitude conditions, while high Ag specimens had a higher vibration cycles to failure under high strain conditions. This was closely related to the striated deformation along the main crack.

原文English
主出版物標題Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
發行者Institute of Electrical and Electronics Engineers Inc.
頁面276-281
頁數6
ISBN(電子)078037682X, 9780780376823
DOIs
出版狀態Published - 2002 一月 1
事件4th International Symposium on Electronic Materials and Packaging, EMAP 2002 - Kaohsiung, Taiwan
持續時間: 2002 十二月 42002 十二月 6

出版系列

名字Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Other

Other4th International Symposium on Electronic Materials and Packaging, EMAP 2002
國家Taiwan
城市Kaohsiung
期間02-12-0402-12-06

    指紋

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Materials Science(all)

引用此

Song, J. M., Lan, G. F., Lui, T-S., & Chen, L. H. (2002). Microstructural features and vibration fracture behavior of Sn-Zn-Ag solder alloys. 於 Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 (頁 276-281). [1188850] (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMAP.2002.1188850