Microstructure and adhesion strength of Sn-9Zn-1.5Ag-xBi (x = 0 wt% and 2 wt%)/Cu after electrochemical polarization in a 3.5 wt% NaCl solution

Wang Long Li, Ying Ru Chen, Kuo Ming Chang, Chih Yao Liu, Min Hsiung Hon, Moo Chin Wang

研究成果: Article同行評審

7 引文 斯高帕斯(Scopus)

摘要

The microstructure and adhesion strength of the Sn-9Zn-1.5Ag-xBi (x = 0 wt% and 2 wt%)/Cu interface after electrochemical polarization have been studied by X-ray diffraction (XRD), scanning electron microscopy (SEM) and pull-off testing. The equilibrium potentials of Sn-9Zn-1.5Ag/Cu and Sn-9Zn-1.5Ag-2Bi/Cu are -1.31 Vsce and -1.22 Vsce, respectively, indicating that Sn-9Zn-1.5Ag-2Bi/Cu has a better corrosion resistance than that of Sn-9Zn-1.5Ag/Cu. The intermetallic compounds of Cu6Sn5, Cu5Zn8 and Ag3Sn are formed at the soldered interface between the Sn-9Zn-1.5Ag-xBi solder alloy and the Cu substrate. The scallop-shaped Cu6Sn5 is close to the Cu substrate and the scallop-shaped Cu5Zn8 is found at the interface in the solder matrix after soldering at 250 °C for 10 s. The corrosion products are ZnCl2, SnCl2 and ZnO. On the other hand, pits are also formed on the surface of both solder alloys. The interfacial adhesion strength of the Sn-9Zn-1.5Ag/Cu and Sn-9Zn-1.5Ag-2Bi/Cu decreases from 8.27 ± 0.56 MPa and 12.67 ± 0.45 MPa to 4.78 ± 0.45 MPa and 8.14 ± 0.38 MPa, respectively, after electrochemical polarization in a 3.5 wt% NaCl solution. The fracture path of the Sn-9Zn-1.5Ag-2Bi/Cu is along the solder alloy/ZnO and solder/Cu6Sn5 interfaces.

原文English
頁(從 - 到)160-165
頁數6
期刊Journal of Alloys and Compounds
461
發行號1-2
DOIs
出版狀態Published - 2008 八月 11

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

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