Microstructure and adhesion strength of Sn-9Zn-1.5Ag-xBi (x = 0 wt% and 2 wt%)/Cu after electrochemical polarization in a 3.5 wt% NaCl solution

Wang Long Li, Ying Ru Chen, Kuo Ming Chang, Chih Yao Liu, Min Hsiung Hon, Moo Chin Wang

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Chemical Compounds

Engineering & Materials Science