Microstructure and formation of copper oxide in the Cu electro-polishing process

Te Ming Kung, Michael Rong Shie Huang, Jung Chih Tsao, Chuan Pu Liu, Ying Lang Wang

研究成果: Article同行評審

5 引文 斯高帕斯(Scopus)

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Engineering & Materials Science

Physics & Astronomy

Chemical Compounds