Microstructure, electric flame-off (EFO) characteristics and tensile properties of silver-lanthanum alloy wire

Hao Wen Hsueh, Fei Yi Hung, Truan Sheng Lui, Li Hui Chen, Jun Kai Chang

研究成果: Article同行評審

18 引文 斯高帕斯(Scopus)

摘要

Silver has potential for application in the electronic packaging industry because of its great electrical and thermal properties and lower price compared to that of gold. Silver oxidizes easily, so doping lanthanum to form Ag-La alloy improves its anti-oxidation capacity. In this study, the microstructure, tensile properties, electronic flame-off (EFO) characteristics, and fusing current of Ag-La alloy wire (φ = 20 μm) are studied. Samples annealed at three temperatures (325 °C, 375 °C, and 425 °C) are analyzed. According to the experimental results, after annealing at 425 °C, Ag-La alloy wire recrystallized, giving it a tensile strength similar to that of pure silver wire and a uniform structure. Doping lanthanum reduced the diameter of free air balls (FABs) in the EFO process. The fusing current of Ag-La wire was about 0.45 A, and the grains of Ag-La wire grew to the size of the wire diameter when a 0.4 A current (90% fusing current) was applied for a long time. Ag-La alloy wire can be used in the electronic packaging industry.

原文English
頁(從 - 到)2564-2569
頁數6
期刊Microelectronics Reliability
54
發行號11
DOIs
出版狀態Published - 2014 11月 1

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 原子與分子物理與光學
  • 凝聚態物理學
  • 安全、風險、可靠性和品質
  • 表面、塗料和薄膜
  • 電氣與電子工程

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