MODAL ANALYSIS OF MULTI-CELL COMPOSITE WING STRUCTURES USING VARIABLE THICKNESS SANDWICH PLATE MODELS

Meng Ling Hsieh, Chyanbin Hwu

研究成果: Conference contribution

摘要

The main goal of this paper is to develop a simple and accurate method to find the natural frequencies and vibration modes of a multi-cell composite wing structure. A typical wing structure, which consists of skins, stringers, spars, and ribs, is usually too complicated to be analyzed analytically, and preparing a detailed finite element model is also a tedious and time-consuming task. To simplify the analysis in early airplane design stages, a finite element method is developed for multi-cell composite wing structures. The wing is modelled as a moderately thick sand-wich plate of variable core thickness using the first order shear deformation theory. By introducing a pseudolamina, the stringers are integrated into the laminated skins, and the compound of stringers and skins comprise facesheets, which bear the in-plane loading, of the sandwich plate model. The ribs and spar webs are designed to bear the transverse shear loadings and maintain the shape of an airfoil. Therefore, they are represented by an equivalent anti-plane core, whose thickness varies according to the airfoil. After setting up a sandwich plate model for the wing structure, we derive the finite element formulation for a sandwich plate of variable thickness with Hamilton's principle. Using this formulation, we perform modal analysis on the equivalent sandwich plate of the wing structure. A numerical example is presented to demonstrate the method developed in this paper.

原文English
主出版物標題Proceedings of the 29th International Congress on Sound and Vibration, ICSV 2023
編輯Eleonora Carletti
發行者Society of Acoustics
ISBN(電子)9788011034238
出版狀態Published - 2023
事件29th International Congress on Sound and Vibration, ICSV 2023 - Prague, Czech Republic
持續時間: 2023 7月 92023 7月 13

出版系列

名字Proceedings of the International Congress on Sound and Vibration
ISSN(電子)2329-3675

Conference

Conference29th International Congress on Sound and Vibration, ICSV 2023
國家/地區Czech Republic
城市Prague
期間23-07-0923-07-13

All Science Journal Classification (ASJC) codes

  • 聲學與超音波

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