Modeling of chemical mechanical polishing processes by cellular automata and finite element/Matlab integration methods

Kuo Shen Chen, Shang Lun Wu

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

In this work, novel chemical-mechanical polishing modeling schemes in both wafer and device levels are proposed and analyzed. The cellular automata method, based on Preston equation and contact mechanics, are used for analyzing the wafer level material removing rate. On the other hand, a finite element and Matlab integration scheme is also developed, primarily for addressing the structural integrity of interconnected structures after polishing. These methods are validated by comparing the previous reported analysis and experimental data. Finally, these schemes are used for parametric studies for guiding process optimization.

原文English
主出版物標題2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
出版狀態Published - 2013 九月 2
事件2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013 - Barcelona, Spain
持續時間: 2013 四月 162013 四月 18

出版系列

名字2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013

Other

Other2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
國家Spain
城市Barcelona
期間13-04-1613-04-18

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture

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