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Modification of DLC films for MEMS applications
Franklin Chau Nan Hong, Yoou Bin Guo, Jiun Yau Wang
化學工程學系
研究成果
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Conference article
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重量
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Mathematics
Micro-electro-mechanical Systems
100%
Contact Angle
43%
Water
18%
Substrate
14%
Chemical Vapor Deposition
11%
Thermal Stability
10%
Surface Roughness
9%
Residual Stress
9%
Plasma
6%
Engineering & Materials Science
MEMS
64%
Contact angle
34%
Adhesion
11%
Water
10%
Plasma enhanced chemical vapor deposition
8%
Substrates
8%
Hydrophobicity
8%
Doping (additives)
7%
Thermodynamic stability
6%
Residual stresses
5%
Surface roughness
5%
Chemical Compounds
Hexamethyldisiloxane
44%
Modification
38%
Liquid Film
33%
Residual Stress
8%
Plasma Enhanced Chemical Vapour Deposition
7%
Surface Roughness
6%
Hydrophilicity
5%
Doping Material
5%
Mixture
5%
Hydrophobicity
5%
Thermal Stability
4%
Purity
3%
Physics & Astronomy
microelectromechanical systems
66%
water
10%
adhesion
10%
hydrophobicity
7%
residual stress
5%
thermal stability
5%
surface roughness
5%
vapor deposition
4%