Molecular dynamics studies of heat and stresses in copper substrate scratch with double-walled nano-cones

Yun Che Wang, Jun Liang Chen, Chuan Chen, Yan Chi Chen, Chi Chuan Hwang

研究成果: Conference contribution

摘要

It is of scientific and industrial importance to obtain detailed understanding of heat transfer and stress distributions in the substrate under nano-scale scratching. In this study, the copper (110) substrate was chosen, and the scratching tip was a double-walled nano-cone. It is found that the double-walled nano-cones are more workable than single-walled nano-cones and carbon nanotubes. Moreover, repeated scratches show high aspect-ratio trenches could be obtained by the manufacturing technique. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. It is found the temperature rises locally near the scratch tip, and trailing thermal waves were more prominent than the leading thermal waves. For the case of the scratching temperature at 700 K, the highest temperature during the scratch was found to be about 850 K.

原文English
主出版物標題Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
頁面583-585
頁數3
DOIs
出版狀態Published - 2010 七月 12
事件ASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009 - Shanghai, China
持續時間: 2009 十二月 182009 十二月 21

出版系列

名字Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
2

Other

OtherASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
國家China
城市Shanghai
期間09-12-1809-12-21

All Science Journal Classification (ASJC) codes

  • Fluid Flow and Transfer Processes

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