MULTI-POINT TEMPERATURE SENSING METHOD FOR INTEGRATED CIRCUIT CHIP AND SYSTEM OF THE SAME

貢獻的翻譯標題: 適用於積體電路晶片之多點溫度感測方法及其系統

Kuen-Jong Lee (Inventor), Chung-Ho Chen (Inventor), Wen-Yu Su (Inventor), Soon-Jyh Chang (Inventor), Lih-Yih Chiou (Inventor), Chih-Hung Kuo (Inventor), Chien-Hung Tsai (Inventor), Jai-Ming Lin (Inventor)

研究成果: Patent

摘要

A multi-point temperature sensing method for integrated circuit chips and a system of the same are revealed. The system includes at least one slave temperature sensor embedded at preset positions for measuring temperature of a block and a master temperature sensor embedded in an integrated circuit chip and electrically connected to each slave temperature sensor. Variations of the slave temperature sensor induced by variations of process, voltage and temperature are corrected by the master temperature sensor. Thus the area the temperature sensors required on the integrated circuit chip is dramatically reduced and the stability of the temperature control system is improved. The problem of conventional System-on-a-Chip that only a limited number of temperature sensors could be used due to the area they occupied can be solved.
原文English
專利號9448122
出版狀態Published - 2014 十一月 20

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