Multiple electrodes arrayed dielectrophoretic chip with application on micro-bead manipulation

Fu Ting Chang, Yung-Chun Lee, Chi Cheng Chiu

研究成果: Conference contribution

3 引文 (Scopus)

摘要

This paper investigates new types of dielectrophoretic (DEP) chips which consist of arrayed electrodes and 3D microstructures. The goal is to optimize the sorting, trapping, and manipulating ability of the DEP chip, which is operated with negative-dielectrophoretic forces. As different from conventional DEP chips using only planar electrodes, these new DEP chips consist of ITO top and bottom electrodes, an arrayed gold middle electrode, and an arrayed SU-8 3D microstructure. In order to achieve single-bead manipulation, the size of the SU-8 3D microstructure array matches the size of the beads. It is shown that such a 3D structure not only yields a non-uniform electric field for DEP trapping but also enhances the capability of positioning and immobilization of the trapped beads. In theoretical analysis and simulation, Comsol Multiphysics is applied to simulate the DEP forces in these chips. Experimental results show that the chips can successfully trap and manipulate beads by applying different electrical voltage signals with phase angles on the triple layer electrodes. In order to realize the optimum frequency to operate DEP force, we also investigate the electrical conductivity at different particle sizes. In summary, we fabricate new DEP chips with improving capability of particle sorting, trapping, and manipulating. The design, analysis, and fabrication processes are discussed in details.

原文English
主出版物標題3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
頁面850-853
頁數4
DOIs
出版狀態Published - 2008
事件3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 - Sanya, China
持續時間: 2008 一月 62008 一月 9

Other

Other3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
國家China
城市Sanya
期間08-01-0608-01-09

指紋

Electrodes
Sorting
Microstructure
Gold
Particle size
Electric fields
Fabrication
Electric potential

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

引用此文

Chang, F. T., Lee, Y-C., & Chiu, C. C. (2008). Multiple electrodes arrayed dielectrophoretic chip with application on micro-bead manipulation. 於 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 (頁 850-853). [4484457] https://doi.org/10.1109/NEMS.2008.4484457
Chang, Fu Ting ; Lee, Yung-Chun ; Chiu, Chi Cheng. / Multiple electrodes arrayed dielectrophoretic chip with application on micro-bead manipulation. 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008. 2008. 頁 850-853
@inproceedings{7737a7f9c1524e6f8cd339866540f302,
title = "Multiple electrodes arrayed dielectrophoretic chip with application on micro-bead manipulation",
abstract = "This paper investigates new types of dielectrophoretic (DEP) chips which consist of arrayed electrodes and 3D microstructures. The goal is to optimize the sorting, trapping, and manipulating ability of the DEP chip, which is operated with negative-dielectrophoretic forces. As different from conventional DEP chips using only planar electrodes, these new DEP chips consist of ITO top and bottom electrodes, an arrayed gold middle electrode, and an arrayed SU-8 3D microstructure. In order to achieve single-bead manipulation, the size of the SU-8 3D microstructure array matches the size of the beads. It is shown that such a 3D structure not only yields a non-uniform electric field for DEP trapping but also enhances the capability of positioning and immobilization of the trapped beads. In theoretical analysis and simulation, Comsol Multiphysics is applied to simulate the DEP forces in these chips. Experimental results show that the chips can successfully trap and manipulate beads by applying different electrical voltage signals with phase angles on the triple layer electrodes. In order to realize the optimum frequency to operate DEP force, we also investigate the electrical conductivity at different particle sizes. In summary, we fabricate new DEP chips with improving capability of particle sorting, trapping, and manipulating. The design, analysis, and fabrication processes are discussed in details.",
author = "Chang, {Fu Ting} and Yung-Chun Lee and Chiu, {Chi Cheng}",
year = "2008",
doi = "10.1109/NEMS.2008.4484457",
language = "English",
isbn = "9781424419081",
pages = "850--853",
booktitle = "3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008",

}

Chang, FT, Lee, Y-C & Chiu, CC 2008, Multiple electrodes arrayed dielectrophoretic chip with application on micro-bead manipulation. 於 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008., 4484457, 頁 850-853, 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008, Sanya, China, 08-01-06. https://doi.org/10.1109/NEMS.2008.4484457

Multiple electrodes arrayed dielectrophoretic chip with application on micro-bead manipulation. / Chang, Fu Ting; Lee, Yung-Chun; Chiu, Chi Cheng.

3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008. 2008. p. 850-853 4484457.

研究成果: Conference contribution

TY - GEN

T1 - Multiple electrodes arrayed dielectrophoretic chip with application on micro-bead manipulation

AU - Chang, Fu Ting

AU - Lee, Yung-Chun

AU - Chiu, Chi Cheng

PY - 2008

Y1 - 2008

N2 - This paper investigates new types of dielectrophoretic (DEP) chips which consist of arrayed electrodes and 3D microstructures. The goal is to optimize the sorting, trapping, and manipulating ability of the DEP chip, which is operated with negative-dielectrophoretic forces. As different from conventional DEP chips using only planar electrodes, these new DEP chips consist of ITO top and bottom electrodes, an arrayed gold middle electrode, and an arrayed SU-8 3D microstructure. In order to achieve single-bead manipulation, the size of the SU-8 3D microstructure array matches the size of the beads. It is shown that such a 3D structure not only yields a non-uniform electric field for DEP trapping but also enhances the capability of positioning and immobilization of the trapped beads. In theoretical analysis and simulation, Comsol Multiphysics is applied to simulate the DEP forces in these chips. Experimental results show that the chips can successfully trap and manipulate beads by applying different electrical voltage signals with phase angles on the triple layer electrodes. In order to realize the optimum frequency to operate DEP force, we also investigate the electrical conductivity at different particle sizes. In summary, we fabricate new DEP chips with improving capability of particle sorting, trapping, and manipulating. The design, analysis, and fabrication processes are discussed in details.

AB - This paper investigates new types of dielectrophoretic (DEP) chips which consist of arrayed electrodes and 3D microstructures. The goal is to optimize the sorting, trapping, and manipulating ability of the DEP chip, which is operated with negative-dielectrophoretic forces. As different from conventional DEP chips using only planar electrodes, these new DEP chips consist of ITO top and bottom electrodes, an arrayed gold middle electrode, and an arrayed SU-8 3D microstructure. In order to achieve single-bead manipulation, the size of the SU-8 3D microstructure array matches the size of the beads. It is shown that such a 3D structure not only yields a non-uniform electric field for DEP trapping but also enhances the capability of positioning and immobilization of the trapped beads. In theoretical analysis and simulation, Comsol Multiphysics is applied to simulate the DEP forces in these chips. Experimental results show that the chips can successfully trap and manipulate beads by applying different electrical voltage signals with phase angles on the triple layer electrodes. In order to realize the optimum frequency to operate DEP force, we also investigate the electrical conductivity at different particle sizes. In summary, we fabricate new DEP chips with improving capability of particle sorting, trapping, and manipulating. The design, analysis, and fabrication processes are discussed in details.

UR - http://www.scopus.com/inward/record.url?scp=50249140198&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=50249140198&partnerID=8YFLogxK

U2 - 10.1109/NEMS.2008.4484457

DO - 10.1109/NEMS.2008.4484457

M3 - Conference contribution

AN - SCOPUS:50249140198

SN - 9781424419081

SP - 850

EP - 853

BT - 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008

ER -

Chang FT, Lee Y-C, Chiu CC. Multiple electrodes arrayed dielectrophoretic chip with application on micro-bead manipulation. 於 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008. 2008. p. 850-853. 4484457 https://doi.org/10.1109/NEMS.2008.4484457