摘要
This paper investigates new types of dielectrophoretic (DEP) chips which consist of arrayed electrodes and 3D microstructures. The goal is to optimize the sorting, trapping, and manipulating ability of the DEP chip, which is operated with negative-dielectrophoretic forces. As different from conventional DEP chips using only planar electrodes, these new DEP chips consist of ITO top and bottom electrodes, an arrayed gold middle electrode, and an arrayed SU-8 3D microstructure. In order to achieve single-bead manipulation, the size of the SU-8 3D microstructure array matches the size of the beads. It is shown that such a 3D structure not only yields a non-uniform electric field for DEP trapping but also enhances the capability of positioning and immobilization of the trapped beads. In theoretical analysis and simulation, Comsol Multiphysics is applied to simulate the DEP forces in these chips. Experimental results show that the chips can successfully trap and manipulate beads by applying different electrical voltage signals with phase angles on the triple layer electrodes. In order to realize the optimum frequency to operate DEP force, we also investigate the electrical conductivity at different particle sizes. In summary, we fabricate new DEP chips with improving capability of particle sorting, trapping, and manipulating. The design, analysis, and fabrication processes are discussed in details.
| 原文 | English |
|---|---|
| 主出版物標題 | 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 |
| 頁面 | 850-853 |
| 頁數 | 4 |
| DOIs | |
| 出版狀態 | Published - 2008 |
| 事件 | 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 - Sanya, China 持續時間: 2008 一月 6 → 2008 一月 9 |
Other
| Other | 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 |
|---|---|
| 國家 | China |
| 城市 | Sanya |
| 期間 | 08-01-06 → 08-01-09 |
指紋
All Science Journal Classification (ASJC) codes
- Control and Systems Engineering
- Electrical and Electronic Engineering
引用此文
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Multiple electrodes arrayed dielectrophoretic chip with application on micro-bead manipulation. / Chang, Fu Ting; Lee, Yung-Chun; Chiu, Chi Cheng.
3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008. 2008. p. 850-853 4484457.研究成果: Conference contribution
TY - GEN
T1 - Multiple electrodes arrayed dielectrophoretic chip with application on micro-bead manipulation
AU - Chang, Fu Ting
AU - Lee, Yung-Chun
AU - Chiu, Chi Cheng
PY - 2008
Y1 - 2008
N2 - This paper investigates new types of dielectrophoretic (DEP) chips which consist of arrayed electrodes and 3D microstructures. The goal is to optimize the sorting, trapping, and manipulating ability of the DEP chip, which is operated with negative-dielectrophoretic forces. As different from conventional DEP chips using only planar electrodes, these new DEP chips consist of ITO top and bottom electrodes, an arrayed gold middle electrode, and an arrayed SU-8 3D microstructure. In order to achieve single-bead manipulation, the size of the SU-8 3D microstructure array matches the size of the beads. It is shown that such a 3D structure not only yields a non-uniform electric field for DEP trapping but also enhances the capability of positioning and immobilization of the trapped beads. In theoretical analysis and simulation, Comsol Multiphysics is applied to simulate the DEP forces in these chips. Experimental results show that the chips can successfully trap and manipulate beads by applying different electrical voltage signals with phase angles on the triple layer electrodes. In order to realize the optimum frequency to operate DEP force, we also investigate the electrical conductivity at different particle sizes. In summary, we fabricate new DEP chips with improving capability of particle sorting, trapping, and manipulating. The design, analysis, and fabrication processes are discussed in details.
AB - This paper investigates new types of dielectrophoretic (DEP) chips which consist of arrayed electrodes and 3D microstructures. The goal is to optimize the sorting, trapping, and manipulating ability of the DEP chip, which is operated with negative-dielectrophoretic forces. As different from conventional DEP chips using only planar electrodes, these new DEP chips consist of ITO top and bottom electrodes, an arrayed gold middle electrode, and an arrayed SU-8 3D microstructure. In order to achieve single-bead manipulation, the size of the SU-8 3D microstructure array matches the size of the beads. It is shown that such a 3D structure not only yields a non-uniform electric field for DEP trapping but also enhances the capability of positioning and immobilization of the trapped beads. In theoretical analysis and simulation, Comsol Multiphysics is applied to simulate the DEP forces in these chips. Experimental results show that the chips can successfully trap and manipulate beads by applying different electrical voltage signals with phase angles on the triple layer electrodes. In order to realize the optimum frequency to operate DEP force, we also investigate the electrical conductivity at different particle sizes. In summary, we fabricate new DEP chips with improving capability of particle sorting, trapping, and manipulating. The design, analysis, and fabrication processes are discussed in details.
UR - http://www.scopus.com/inward/record.url?scp=50249140198&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=50249140198&partnerID=8YFLogxK
U2 - 10.1109/NEMS.2008.4484457
DO - 10.1109/NEMS.2008.4484457
M3 - Conference contribution
AN - SCOPUS:50249140198
SN - 9781424419081
SP - 850
EP - 853
BT - 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
ER -