Nano-mechanical behavior of low temperature electroplated nano-crystalline Ni films

Chen-Kuei Chung, W. T. Chang

研究成果: Conference contribution

摘要

Conventional electroplated Ni films were performed at high temperatures of 45- 50°C. In this paper, we have studied the low temperature electroplating i.e. low temperature electroplating of nano-crystalline Ni films and their nanomechanical property. The deposits were electroplated in potentiostatic mode and the low electrolytic temperature varied from 0 to 20°C. Grazing incidence X-ray diffractometer was used to examine the polycrystalline phase characteristics and grain size. MTS Nano Indenter® with continuous stiffness measurement (CSM) module and Berkovich indenter were employed to characterize the nano-mechanical property of deposits. The experimental results showed that hardness increased with decreasing electrolytic temperature. It might be attributed to the residual compressive stress. Therefore, low temperature electroplating is favorable for the enhancement of Ni deposits hardness.

原文English
主出版物標題2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
頁面203-206
頁數4
DOIs
出版狀態Published - 2010 十一月 29
事件5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010 - Xiamen, China
持續時間: 2010 一月 202010 一月 23

出版系列

名字2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010

Other

Other5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
國家/地區China
城市Xiamen
期間10-01-2010-01-23

All Science Journal Classification (ASJC) codes

  • 控制與系統工程
  • 電氣與電子工程

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