Nano-particle interaction during chemical-mechanical polishing

Dedy Ng, Milind Kulkarni, Hong Liang, Yeau Ren Jeng, Pai Yau Huang

研究成果: Conference contribution

摘要

We investigate the particle adhering and removal processes during CMP and post-CMP cleaning. The mechanical interaction between abrasive particles and wafer surface was studied using a microcontact wear model. This model considers the particle effects between the polishing interfaces during load balancing. Experimental results on polishing and cleaning are compared with numerical analysis. This study suggests that during post-CMP cleaning, a combined effort in chemical and mechanical interaction (tribochemical interactions) would be effective in removal small particles during cleaning. For large particles, more mechanical forces would be more effective.

原文English
主出版物標題Proceedings of the World Tribology Congress III - 2005
發行者American Society of Mechanical Engineers
頁面389-390
頁數2
ISBN(列印)0791842029, 9780791842027
DOIs
出版狀態Published - 2005
事件2005 World Tribology Congress III - Washington, D.C., United States
持續時間: 2005 9月 122005 9月 16

出版系列

名字Proceedings of the World Tribology Congress III - 2005

Other

Other2005 World Tribology Congress III
國家/地區United States
城市Washington, D.C.
期間05-09-1205-09-16

All Science Journal Classification (ASJC) codes

  • 一般工程

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