Nanoindentation characterization of PECVD silicon nitride on silicon subjected to mechanical fatigue loading

Z. K. Huang, K. S. Ou, Kuo-Shen Chen

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

In this work, the mechanical properties of PECVD silicon nitride deposited on silicon substrates by two different processing conditions were investigated. Indentation method was primary used for qualitatively examining the effect of process conditions to the achieved mechanical properties. The experimental results indicated that the residual stress, fracture toughness and interfacial strength, as well as the fatigue crack propagation were strongly depended on the processing conditions such as deposition temperatures and chamber pressures. Preliminary results indicated that the specimen deposited at a lower temperature and a lower pressure exhibited a much less residual tensile stress and a better interface strength. On the other hand, it was found that RTA could enhance the interfacial strength but the generated high tensile strength could actually reduce the equivalent toughness and leads to structural reliability concerns. In summary, the characterization results should be possible to provide useful information for correlating the mechanical reliability with the processing parameters for future structural design optimization and for improving the structural integrity of PECVD silicon nitride films for MEMS and IC fabrication.

原文English
主出版物標題Microelectromechanical Systems - Materials and Devices IV
頁面173-178
頁數6
DOIs
出版狀態Published - 2011 九月 30
事件2010 MRS Fall Meeting - Boston, MA, United States
持續時間: 2010 十一月 292010 十二月 3

出版系列

名字Materials Research Society Symposium Proceedings
1299
ISSN(列印)0272-9172

Other

Other2010 MRS Fall Meeting
國家United States
城市Boston, MA
期間10-11-2910-12-03

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • 引用此

    Huang, Z. K., Ou, K. S., & Chen, K-S. (2011). Nanoindentation characterization of PECVD silicon nitride on silicon subjected to mechanical fatigue loading. 於 Microelectromechanical Systems - Materials and Devices IV (頁 173-178). (Materials Research Society Symposium Proceedings; 卷 1299). https://doi.org/10.1557/opl.2011.64