摘要
Troubleshooting and production set-up time are often the major contributors for productivity loss in surface mount assembly. The solder reflow process is one of the least understood process segments. The research proposes a neurofuzzy reflow thermal profile control system for a convection oven. An incompatible temperature profile can result in a poor soldering quality and reduced system throughput. This paper proposes a neurofuzzy-based solder reflow thermal profile control system that responds to facilitate the production set-up process. The model is trained and constructed using data from both an experimental design and from historical production records. Customized computer code is used to generate a user-friendly human-machine interface and to link between neurofuzzy-reasoning rules and reflow oven set-up parameters for thermal profile planning and control. Empirical results illustrate the effectiveness and efficiency of the proposed system to solve a practical application.
原文 | English |
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頁(從 - 到) | 89-101 |
頁數 | 13 |
期刊 | International Journal of Systems Science |
卷 | 36 |
發行號 | 2 |
DOIs | |
出版狀態 | Published - 2005 2月 10 |
All Science Journal Classification (ASJC) codes
- 控制與系統工程
- 理論電腦科學
- 電腦科學應用