Neurofuzzy modelling of the reflow thermal profile for surface mount assembly

Tsung Nan Tsai, Taho Yang, Pao A.N. Hou

研究成果: Article同行評審

4 引文 斯高帕斯(Scopus)

摘要

Troubleshooting and production set-up time are often the major contributors for productivity loss in surface mount assembly. The solder reflow process is one of the least understood process segments. The research proposes a neurofuzzy reflow thermal profile control system for a convection oven. An incompatible temperature profile can result in a poor soldering quality and reduced system throughput. This paper proposes a neurofuzzy-based solder reflow thermal profile control system that responds to facilitate the production set-up process. The model is trained and constructed using data from both an experimental design and from historical production records. Customized computer code is used to generate a user-friendly human-machine interface and to link between neurofuzzy-reasoning rules and reflow oven set-up parameters for thermal profile planning and control. Empirical results illustrate the effectiveness and efficiency of the proposed system to solve a practical application.

原文English
頁(從 - 到)89-101
頁數13
期刊International Journal of Systems Science
36
發行號2
DOIs
出版狀態Published - 2005 2月 10

All Science Journal Classification (ASJC) codes

  • 控制與系統工程
  • 理論電腦科學
  • 電腦科學應用

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