Nonlinear viscoelastic constitutive model for organic laminate substrate

Tz Cheng Chiu, Yao Yu Chan, Yi Shao Lai

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

Organic laminate substrate is one of the largest constituent volume-wise in area array packages, and it plays a key role in overall package stress and warpage evolutions during fabrication process and in service conditions. In order to accurately estimate the influences of substrate on stress and warpage, it is important to characterize the time-dependent constitutive behavior of the organic substrate. In this study, a series of tensile creep and creep recovery experiments were performed to characterize the time-dependent behavior of a single-core laminate substrate. Nonlinear viscoelastic constitutive models including the Schapery model and a time-temperature-stress superposition model were developed based on the experimental characterization, and applied to simulate strain responses under cyclic loading conditions. It is shown that the predictions based on the nonlinear viscoelastic models give more accurate estimations on strain responses to creep and creep recovery loadings than the linear viscoelastic model does, in particularly for stress levels higher than 30% of the substrate's fracture strength.

原文English
主出版物標題2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
頁面1759-1766
頁數8
DOIs
出版狀態Published - 2013 9月 9
事件2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 - Las Vegas, NV, United States
持續時間: 2013 5月 282013 5月 31

出版系列

名字Proceedings - Electronic Components and Technology Conference
ISSN(列印)0569-5503

Other

Other2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
國家/地區United States
城市Las Vegas, NV
期間13-05-2813-05-31

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 電氣與電子工程

指紋

深入研究「Nonlinear viscoelastic constitutive model for organic laminate substrate」主題。共同形成了獨特的指紋。

引用此