Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

Weixin Fu; Jun Mizuno; Shuichi Shoji; Takashi Kasahara; Akiko Okada; Shugo Ishizuka

doi:10.1109/ICSJ.2013.6756116

Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

Weixin Fu, Jun Mizuno, Shuichi Shoji, Takashi Kasahara, Akiko Okada, Shugo Ishizuka

智慧與永續製造學位學程

研究成果: Paper › 同行評審

摘要

A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.

原文	English
DOIs	https://doi.org/10.1109/ICSJ.2013.6756116
出版狀態	Published - 2013
事件	2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto, Japan 持續時間: 2013 11月 11 → 2013 11月 13

Conference

Conference	2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013
國家/地區	Japan
城市	Kyoto
期間	13-11-11 → 13-11-13

All Science Journal Classification (ASJC) codes

電氣與電子工程

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10.1109/ICSJ.2013.6756116

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引用此

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title = "Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating",

abstract = "A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.",

author = "Weixin Fu and Jun Mizuno and Shuichi Shoji and Takashi Kasahara and Akiko Okada and Shugo Ishizuka",

year = "2013",

doi = "10.1109/ICSJ.2013.6756116",

language = "English",

note = "2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 ; Conference date: 11-11-2013 Through 13-11-2013",

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TY - CONF

T1 - Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

AU - Fu, Weixin

AU - Mizuno, Jun

AU - Shoji, Shuichi

AU - Kasahara, Takashi

AU - Okada, Akiko

AU - Ishizuka, Shugo

PY - 2013

Y1 - 2013

N2 - A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.

AB - A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.

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UR - http://www.scopus.com/inward/citedby.url?scp=84897521692&partnerID=8YFLogxK

U2 - 10.1109/ICSJ.2013.6756116

DO - 10.1109/ICSJ.2013.6756116

M3 - Paper

AN - SCOPUS:84897521692

T2 - 2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013

Y2 - 11 November 2013 through 13 November 2013

ER -

Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

摘要

Conference

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