Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam

Tao Chi Liu; Chih Chen; Kuo Jung Chiu; Han Wen Lin; Jui Chao Kuo

doi:10.1016/j.matchar.2012.09.002

Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam

Tao Chi Liu, Chih Chen, Kuo Jung Chiu, Han Wen Lin, Jui Chao Kuo

研究成果: Article › 同行評審

5 引文斯高帕斯（Scopus）

摘要

We proposed a novel technique developed from focused ion beam (FIB) polishing for sample preparation of electron backscatter diffraction (EBSD) measurement. A low-angle incident gallium ion beam with a high acceleration voltage of 30 kV was used to eliminate the surface roughness of cross-sectioned microbumps resulting from mechanical polishing. This work demonstrates the application of the FIB polishing technique to solders for a high-quality sample preparation for EBSD measurement after mechanical polishing.

原文	English
頁（從 - 到）	42-48
頁數	7
期刊	Materials Characterization
卷	74
DOIs	https://doi.org/10.1016/j.matchar.2012.09.002
出版狀態	Published - 2012 12月

All Science Journal Classification (ASJC) codes

一般材料科學
凝聚態物理學
材料力學
機械工業

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10.1016/j.matchar.2012.09.002

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title = "Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam",

abstract = "We proposed a novel technique developed from focused ion beam (FIB) polishing for sample preparation of electron backscatter diffraction (EBSD) measurement. A low-angle incident gallium ion beam with a high acceleration voltage of 30 kV was used to eliminate the surface roughness of cross-sectioned microbumps resulting from mechanical polishing. This work demonstrates the application of the FIB polishing technique to solders for a high-quality sample preparation for EBSD measurement after mechanical polishing.",

author = "Liu, {Tao Chi} and Chih Chen and Chiu, {Kuo Jung} and Lin, {Han Wen} and Kuo, {Jui Chao}",

note = "Funding Information: The authors would like to thank the National Science Council (ROC) through grant no. NSC 100-2628-E-006-024-MY3 , and the Center for Micro/Nano Science and Technology for providing the facilities.",

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AU - Liu, Tao Chi

AU - Chen, Chih

AU - Chiu, Kuo Jung

AU - Lin, Han Wen

AU - Kuo, Jui Chao

N1 - Funding Information: The authors would like to thank the National Science Council (ROC) through grant no. NSC 100-2628-E-006-024-MY3 , and the Center for Micro/Nano Science and Technology for providing the facilities.

PY - 2012/12

Y1 - 2012/12

N2 - We proposed a novel technique developed from focused ion beam (FIB) polishing for sample preparation of electron backscatter diffraction (EBSD) measurement. A low-angle incident gallium ion beam with a high acceleration voltage of 30 kV was used to eliminate the surface roughness of cross-sectioned microbumps resulting from mechanical polishing. This work demonstrates the application of the FIB polishing technique to solders for a high-quality sample preparation for EBSD measurement after mechanical polishing.

AB - We proposed a novel technique developed from focused ion beam (FIB) polishing for sample preparation of electron backscatter diffraction (EBSD) measurement. A low-angle incident gallium ion beam with a high acceleration voltage of 30 kV was used to eliminate the surface roughness of cross-sectioned microbumps resulting from mechanical polishing. This work demonstrates the application of the FIB polishing technique to solders for a high-quality sample preparation for EBSD measurement after mechanical polishing.

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M3 - Article

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SN - 1044-5803

VL - 74

SP - 42

EP - 48

JO - Materials Characterization

JF - Materials Characterization

ER -

Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam

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