Novel package technology of ultra high power light-emitting diodes by electroplating

Y. K. Su, K. C. Chen, C. L. Lin, Wen-Kuei Chuang, J. Q. Huang, Chiu Hsu Hsiao

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

Thermal management of devices package is now a critical problem for applications of high power light emitting diodes (LEDs). In this paper coppers were first electroplated on the novel package red, green, and blue LED chips directly. With the copper plating layer, the endurable injection current of these LED chips can be increased easily from conventional 350 mA to more than 1680 mA in room temperature; especially the input power of the GaN-based single chip blue LED can be increased to 12W. The relative luminous intensity at 350 mA of the novel red, green, and blue LEDs (RGB LEDs) have 53%, 69%, and 23% enhancement respectively compared with those of the conventional packaged LEDs. When the injection current of these LED chips were increased to 850mA , the relative luminous intensity of the novel RGB LEDs chips have 431% and 83%, and 18% enhancement respectively compared with those of the conventional packaged ones.

原文English
主出版物標題29th Annual IEEE Compound Semiconductor Integrated Circuit Symposium 2007 IEEE CSIC Symposium
主出版物子標題"Tastes of the Northwest" - Technical Digest 2007
頁面24-27
頁數4
DOIs
出版狀態Published - 2007 12月 1
事件29th Annual IEEE Compound Semiconductor Integrated Circuit Symposium 2007 IEEE CSIC Symposium: "Tastes of the Northwest" - Portland, OR, United States
持續時間: 2007 10月 142007 10月 17

出版系列

名字Technical Digest - IEEE Compound Semiconductor Integrated Circuit Symposium, CSIC
ISSN(列印)1550-8781

Other

Other29th Annual IEEE Compound Semiconductor Integrated Circuit Symposium 2007 IEEE CSIC Symposium: "Tastes of the Northwest"
國家/地區United States
城市Portland, OR
期間07-10-1407-10-17

All Science Journal Classification (ASJC) codes

  • 工程 (全部)

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