Novel semiconductor business model - Engineering chain for the semiconductor industry

Jonathan Yung Cheng Chang, Fan Tien Cheng, Tsung Li Wang

研究成果: Conference contribution

4 引文 斯高帕斯(Scopus)

摘要

The foundry business model was first developed by TSMC in 1985. A foundry should provide customers with IC manufacturing services. Those customers include IC design houses, integrated device manufacturers (IDM), and system suppliers. However, most electronic products are consumer products, and their life cycle has been reducing with time. An IC design house needs to continuously develop ICs with new functions to meet the current market demand for consumable products. Meanwhile, to support customers for high speed and low cost end product development, foundry service providers must also continue developing new process technologies, from 0.25um down to 32nm. Unfortunately, advances in new manufacturing process technologies also create difficulties in new IC design. These advances increase the IC design failure rate. Currently, no effective working model and system exists to solve this problem. To formulate this high IC design failure problem, this work proposes a novel Engineering-Chain (EC) business model. This work also proposes an Engineering Chain Management System (ECMS) to help achieve the goals of EC, such as improving IC design success rate, reducing IC design cycle time, lowering IC design costs, and increasing revenue.

原文English
主出版物標題2007 IEEE International Conference on Robotics and Automation, ICRA'07
頁面1597-1602
頁數6
DOIs
出版狀態Published - 2007
事件2007 IEEE International Conference on Robotics and Automation, ICRA'07 - Rome, Italy
持續時間: 2007 4月 102007 4月 14

出版系列

名字Proceedings - IEEE International Conference on Robotics and Automation
ISSN(列印)1050-4729

Other

Other2007 IEEE International Conference on Robotics and Automation, ICRA'07
國家/地區Italy
城市Rome
期間07-04-1007-04-14

All Science Journal Classification (ASJC) codes

  • 軟體
  • 控制與系統工程
  • 人工智慧
  • 電氣與電子工程

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