On temperature prediction of multiple-chip packages by a combined analysis-finite element method

Horng Wen Wu, Ming Che Liu

研究成果: Article同行評審

1 引文 斯高帕斯(Scopus)

摘要

Numerical calculations based on a hybrid method, which consists of analytic and finite-element method, have been carried out to study temperature distributions of multi-chip packages. Unlike finite element method, this method is able to discretize the distributed sources with discontinuities into coarse elements, and the solution is still accurately calculated. The effect of Reynolds number and channel wall-to-wall spacing were investigated. The results obtained from the numerical study have been compared with the previous experimental data, and found to be favorable.

原文English
頁(從 - 到)197-204
頁數8
期刊Heat and Mass Transfer
30
發行號3
DOIs
出版狀態Published - 1995 二月 1

All Science Journal Classification (ASJC) codes

  • 凝聚態物理學
  • 流體流動和轉移過程

指紋

深入研究「On temperature prediction of multiple-chip packages by a combined analysis-finite element method」主題。共同形成了獨特的指紋。

引用此