On test and repair of 3D random access memory

Cheng Wen Wu, Shyue Kun Lu, Jin Fu Li

研究成果: Conference contribution

13 引文 斯高帕斯(Scopus)

摘要

The three-dimensional (3D) random access memory (RAM) using through-silicon via (TSV) has been considered as a promising approach to overcome the memory wall. However, cost and yield are two key issues for volume production of 3D RAMs, and yield enhancement increasingly requires test techniques. In this paper, we first introduce issues and existing techniques for the testing and yield enhancement of 3D RAMs. Then, a built-in self-repair (BISR) technique for 3D RAM using global redundancy is presented. According to the redundancy analysis results of each die with the BISR circuit, the die-to-die (d2d) and wafer-to-wafer (w2w) stacking problems are transferred to the bipartite maximal matching problem. Then, heuristic algorithms are also proposed to optimize the stacking yield.

原文English
主出版物標題ASP-DAC 2012 - 17th Asia and South Pacific Design Automation Conference
頁面744-749
頁數6
DOIs
出版狀態Published - 2012 4月 26
事件17th Asia and South Pacific Design Automation Conference, ASP-DAC 2012 - Sydney, NSW, Australia
持續時間: 2012 1月 302012 2月 2

出版系列

名字Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Other

Other17th Asia and South Pacific Design Automation Conference, ASP-DAC 2012
國家/地區Australia
城市Sydney, NSW
期間12-01-3012-02-02

All Science Journal Classification (ASJC) codes

  • 電腦科學應用
  • 電腦繪圖與電腦輔助設計
  • 電氣與電子工程

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