On the multiscale finite element analysis for interfacial fracture in CU/low-k interconnects

Tz-Cheng Chiu, Huang Chun Lin

研究成果: Conference contribution

摘要

The interface crack problem in integrated circuit devices was considered by using global and local modeling approach. In the global analysis the thin film interconnect was modeled by a homogenized layer with material constants obtained from representative volume element (RVE) analysis. Local analyses were then considered to determine fracture mechanics parameters. It was shown that the multiscale model with RVE approach gives accurate fracture mechanics parameters for an interface crack under either thermal or mechanical loads; while significant error was observed when the thin film layers are ignored in the global analysis. The problem of an interface crack between low-k dielectric and etch-stop thin film in a flip-chip package under thermal loading was also investigated as an application example of the multiscale modeling.

原文English
主出版物標題2007 Proceedings of the ASME InterPack Conference, IPACK 2007
頁面79-85
頁數7
1
DOIs
出版狀態Published - 2007
事件ASME Electronic and Photonics Packaging Division - Vancouver, BC, United States
持續時間: 2007 七月 82007 七月 12

Other

OtherASME Electronic and Photonics Packaging Division
國家United States
城市Vancouver, BC
期間07-07-0807-07-12

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Computer Science Applications
  • Information Systems

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