One-Step Synthesis of Antioxidative Graphene-Wrapped Copper Nanoparticles on Flexible Substrates for Electronic and Electrocatalytic Applications

Chi Ang Tseng, Chiao Chen Chen, Rajesh Kumar Ulaganathan, Chuan Pei Lee, Hsu Cheng Chiang, Chin Fu Chang, Yit Tsong Chen

研究成果: Article

6 引文 (Scopus)

摘要

In this study, we report a novel, one-step synthesis method to fabricate multilayer graphene (MLG)-wrapped copper nanoparticles (CuNPs) directly on various substrates (e.g., polyimide film (PI), carbon cloth (CC), or Si wafer (Si)). The electrical resistivities of the pristine MLG-CuNPs/PI and MLG-CuNPs/Si were measured 1.7 × 10-6 and 1.4 × 10-6 ω·m, respectively, of which both values are ∼100-fold lower than earlier reports. The MLG shell could remarkably prevent the Cu nanocore from serious damages after MLG-CuNPs being exposed to various harsh conditions. Both MLG-CuNPs/PI and MLG-CuNPs/Si retained almost their conductivities after ambient annealing at 150 °C. Furthermore, the flexible MLG-CuNPs/PI exhibits excellent mechanical durability after 1000 bending cycles. We also demonstrate that the MLG-CuNPs/PI can be used as promising source-drain electrodes in fabricating flexible graphene-based field-effect transistor (G-FET) devices. Finally, the MLG-CuNPs/CC was shown to possess high performance and durability toward hydrogen evolution reaction (HER).

原文English
頁(從 - 到)25067-25072
頁數6
期刊ACS Applied Materials and Interfaces
9
發行號30
DOIs
出版狀態Published - 2017 八月 2

指紋

Graphite
Graphene
Copper
Multilayers
Nanoparticles
Substrates
Polyimides
Durability
Carbon films
Field effect transistors
Hydrogen
Carbon
Annealing

All Science Journal Classification (ASJC) codes

  • Materials Science(all)

引用此文

Tseng, Chi Ang ; Chen, Chiao Chen ; Ulaganathan, Rajesh Kumar ; Lee, Chuan Pei ; Chiang, Hsu Cheng ; Chang, Chin Fu ; Chen, Yit Tsong. / One-Step Synthesis of Antioxidative Graphene-Wrapped Copper Nanoparticles on Flexible Substrates for Electronic and Electrocatalytic Applications. 於: ACS Applied Materials and Interfaces. 2017 ; 卷 9, 編號 30. 頁 25067-25072.
@article{dde339fc2908424aaeb2b236507dcb19,
title = "One-Step Synthesis of Antioxidative Graphene-Wrapped Copper Nanoparticles on Flexible Substrates for Electronic and Electrocatalytic Applications",
abstract = "In this study, we report a novel, one-step synthesis method to fabricate multilayer graphene (MLG)-wrapped copper nanoparticles (CuNPs) directly on various substrates (e.g., polyimide film (PI), carbon cloth (CC), or Si wafer (Si)). The electrical resistivities of the pristine MLG-CuNPs/PI and MLG-CuNPs/Si were measured 1.7 × 10-6 and 1.4 × 10-6 ω·m, respectively, of which both values are ∼100-fold lower than earlier reports. The MLG shell could remarkably prevent the Cu nanocore from serious damages after MLG-CuNPs being exposed to various harsh conditions. Both MLG-CuNPs/PI and MLG-CuNPs/Si retained almost their conductivities after ambient annealing at 150 °C. Furthermore, the flexible MLG-CuNPs/PI exhibits excellent mechanical durability after 1000 bending cycles. We also demonstrate that the MLG-CuNPs/PI can be used as promising source-drain electrodes in fabricating flexible graphene-based field-effect transistor (G-FET) devices. Finally, the MLG-CuNPs/CC was shown to possess high performance and durability toward hydrogen evolution reaction (HER).",
author = "Tseng, {Chi Ang} and Chen, {Chiao Chen} and Ulaganathan, {Rajesh Kumar} and Lee, {Chuan Pei} and Chiang, {Hsu Cheng} and Chang, {Chin Fu} and Chen, {Yit Tsong}",
year = "2017",
month = "8",
day = "2",
doi = "10.1021/acsami.7b06490",
language = "English",
volume = "9",
pages = "25067--25072",
journal = "ACS applied materials & interfaces",
issn = "1944-8244",
publisher = "American Chemical Society",
number = "30",

}

One-Step Synthesis of Antioxidative Graphene-Wrapped Copper Nanoparticles on Flexible Substrates for Electronic and Electrocatalytic Applications. / Tseng, Chi Ang; Chen, Chiao Chen; Ulaganathan, Rajesh Kumar; Lee, Chuan Pei; Chiang, Hsu Cheng; Chang, Chin Fu; Chen, Yit Tsong.

於: ACS Applied Materials and Interfaces, 卷 9, 編號 30, 02.08.2017, p. 25067-25072.

研究成果: Article

TY - JOUR

T1 - One-Step Synthesis of Antioxidative Graphene-Wrapped Copper Nanoparticles on Flexible Substrates for Electronic and Electrocatalytic Applications

AU - Tseng, Chi Ang

AU - Chen, Chiao Chen

AU - Ulaganathan, Rajesh Kumar

AU - Lee, Chuan Pei

AU - Chiang, Hsu Cheng

AU - Chang, Chin Fu

AU - Chen, Yit Tsong

PY - 2017/8/2

Y1 - 2017/8/2

N2 - In this study, we report a novel, one-step synthesis method to fabricate multilayer graphene (MLG)-wrapped copper nanoparticles (CuNPs) directly on various substrates (e.g., polyimide film (PI), carbon cloth (CC), or Si wafer (Si)). The electrical resistivities of the pristine MLG-CuNPs/PI and MLG-CuNPs/Si were measured 1.7 × 10-6 and 1.4 × 10-6 ω·m, respectively, of which both values are ∼100-fold lower than earlier reports. The MLG shell could remarkably prevent the Cu nanocore from serious damages after MLG-CuNPs being exposed to various harsh conditions. Both MLG-CuNPs/PI and MLG-CuNPs/Si retained almost their conductivities after ambient annealing at 150 °C. Furthermore, the flexible MLG-CuNPs/PI exhibits excellent mechanical durability after 1000 bending cycles. We also demonstrate that the MLG-CuNPs/PI can be used as promising source-drain electrodes in fabricating flexible graphene-based field-effect transistor (G-FET) devices. Finally, the MLG-CuNPs/CC was shown to possess high performance and durability toward hydrogen evolution reaction (HER).

AB - In this study, we report a novel, one-step synthesis method to fabricate multilayer graphene (MLG)-wrapped copper nanoparticles (CuNPs) directly on various substrates (e.g., polyimide film (PI), carbon cloth (CC), or Si wafer (Si)). The electrical resistivities of the pristine MLG-CuNPs/PI and MLG-CuNPs/Si were measured 1.7 × 10-6 and 1.4 × 10-6 ω·m, respectively, of which both values are ∼100-fold lower than earlier reports. The MLG shell could remarkably prevent the Cu nanocore from serious damages after MLG-CuNPs being exposed to various harsh conditions. Both MLG-CuNPs/PI and MLG-CuNPs/Si retained almost their conductivities after ambient annealing at 150 °C. Furthermore, the flexible MLG-CuNPs/PI exhibits excellent mechanical durability after 1000 bending cycles. We also demonstrate that the MLG-CuNPs/PI can be used as promising source-drain electrodes in fabricating flexible graphene-based field-effect transistor (G-FET) devices. Finally, the MLG-CuNPs/CC was shown to possess high performance and durability toward hydrogen evolution reaction (HER).

UR - http://www.scopus.com/inward/record.url?scp=85026831037&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85026831037&partnerID=8YFLogxK

U2 - 10.1021/acsami.7b06490

DO - 10.1021/acsami.7b06490

M3 - Article

AN - SCOPUS:85026831037

VL - 9

SP - 25067

EP - 25072

JO - ACS applied materials & interfaces

JF - ACS applied materials & interfaces

SN - 1944-8244

IS - 30

ER -