One-Step Synthesis of Antioxidative Graphene-Wrapped Copper Nanoparticles on Flexible Substrates for Electronic and Electrocatalytic Applications

Chi Ang Tseng, Chiao Chen Chen, Rajesh Kumar Ulaganathan, Chuan Pei Lee, Hsu Cheng Chiang, Chin Fu Chang, Yit Tsong Chen

研究成果: Article同行評審

18 引文 斯高帕斯(Scopus)

摘要

In this study, we report a novel, one-step synthesis method to fabricate multilayer graphene (MLG)-wrapped copper nanoparticles (CuNPs) directly on various substrates (e.g., polyimide film (PI), carbon cloth (CC), or Si wafer (Si)). The electrical resistivities of the pristine MLG-CuNPs/PI and MLG-CuNPs/Si were measured 1.7 × 10-6 and 1.4 × 10-6 ω·m, respectively, of which both values are ∼100-fold lower than earlier reports. The MLG shell could remarkably prevent the Cu nanocore from serious damages after MLG-CuNPs being exposed to various harsh conditions. Both MLG-CuNPs/PI and MLG-CuNPs/Si retained almost their conductivities after ambient annealing at 150 °C. Furthermore, the flexible MLG-CuNPs/PI exhibits excellent mechanical durability after 1000 bending cycles. We also demonstrate that the MLG-CuNPs/PI can be used as promising source-drain electrodes in fabricating flexible graphene-based field-effect transistor (G-FET) devices. Finally, the MLG-CuNPs/CC was shown to possess high performance and durability toward hydrogen evolution reaction (HER).

原文English
頁(從 - 到)25067-25072
頁數6
期刊ACS Applied Materials and Interfaces
9
發行號30
DOIs
出版狀態Published - 2017 8月 2

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)

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