Orientation characterization of columnar-grained aluminum at triple junctions

Chien Shun Yun, Kuan Tai Lui, Jui Chao Kuo

研究成果: Article同行評審

摘要

In this study, we used the digital-image-correlation (DIC) technique to investigate microstrain distribution after 5% deformation. Electron backscatter diffraction (EBSD) was also investigated in the orientation maps at triple junctions for an aluminum polycrystal after annealing at 360°C for 5, 20, 40, and 80 min, respectively. The results of the strain distribution demonstrated that strong deformation heterogeneities occur in the form of macroscopic shear localizations and that the average orientation spread or misorientation increases during annealing. Further, grain boundary migration was observed even at grain boundaries with the smallest differences in the orientation spread.

原文English
頁(從 - 到)2493-2497
頁數5
期刊Materials Transactions
50
發行號10
DOIs
出版狀態Published - 2009 10月

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)
  • 凝聚態物理學
  • 材料力學
  • 機械工業

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