Orientation transformation of Pb grains in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints during electromigration test

Ying Ta Chiu, Kwang Lung Lin, Yi Shao Lai

研究成果: Article同行評審

7 引文 斯高帕斯(Scopus)

摘要

Microstructural evolution occurred in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder bump during electromigration. Scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) observations for 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints subjected to 5 kA/cm2 current stressing at 150 °C revealed a gradual orientation transformation of Ph grains from random textures toward (101) grains. We proposed that the combination of reducing the surface energy of Pb grain boundaries and resistance of the entire polycrystalline system are the driving force for the orientation transformation of Ph grains during an electromigration test.

原文English
頁(從 - 到)1877-1881
頁數5
期刊Journal of Materials Research
23
發行號7
DOIs
出版狀態Published - 2008 七月

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)
  • 凝聚態物理學
  • 材料力學
  • 機械工業

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