TY - JOUR
T1 - Packaging a fiber bragg grating without preloading in a simple athermal bimaterial device
AU - Lo, Yu Lung
AU - Kuo, Chih Ping
PY - 2002/2
Y1 - 2002/2
N2 - This study presents two athermal packages for compensating for the temperature deviations in an optical fiber Bragg grating (FBG). Usually, a pre-loading mechanism is necessary in packaging the FBG onto bimaterial devices. However, through a unique bonding process design, the pre-loading mechanism in the packaging could be eliminated. During the manufacturing processes, AB thermally cured adhesive is used to affix the FBG to the device under a thermal state. In this way, the FBG affixed to the devices will be under tension when the temperature drops to room temperature. The devices can also be placed continuously under a thermal state after a thermal curing process for a pre-determined period of time to perform annealing on the FBG, and thereby, further simplifying the manufacturing process. As a result, the total variation in the Bragg wavelength over the range from -40 to +80 °C were around 0.1 nm in the two proposed athermal packages.
AB - This study presents two athermal packages for compensating for the temperature deviations in an optical fiber Bragg grating (FBG). Usually, a pre-loading mechanism is necessary in packaging the FBG onto bimaterial devices. However, through a unique bonding process design, the pre-loading mechanism in the packaging could be eliminated. During the manufacturing processes, AB thermally cured adhesive is used to affix the FBG to the device under a thermal state. In this way, the FBG affixed to the devices will be under tension when the temperature drops to room temperature. The devices can also be placed continuously under a thermal state after a thermal curing process for a pre-determined period of time to perform annealing on the FBG, and thereby, further simplifying the manufacturing process. As a result, the total variation in the Bragg wavelength over the range from -40 to +80 °C were around 0.1 nm in the two proposed athermal packages.
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U2 - 10.1109/TADVP.2002.1017685
DO - 10.1109/TADVP.2002.1017685
M3 - Article
AN - SCOPUS:0036478891
SN - 1521-3323
VL - 25
SP - 50
EP - 53
JO - IEEE Transactions on Advanced Packaging
JF - IEEE Transactions on Advanced Packaging
IS - 1
ER -