摘要
The main purpose of the present study was to investigate the feasibility of applying the technique of contactless dielectrophoresis (cDEP) on an insulator-based dielectrophoretic (iDEP) microdevice with effective focusing of particles. The particles were introduced into the microchannel and pre-confined hydrodynamically by the funnel-shaped insulating structures close to the inlet. The particles were, therefore, repelled toward the center of the microchannel by the negative dielectrophoretic forces generated by the insulating structures. The microchip was fabricated by the technique of cDEP. The electric field in the main microchannel was generated by using electrodes inserted into two conductive micro-reservoirs, which were separated from the main microchannel by thin insulating barriers made of 20 μm-width of PDMS. The impedance of the PDMS barrier under different frequencies was measured by an impedance analyzer and the fitting curve to experimental data using the least-squares method were also addressed. The results revealed the capacitive behavior of the PDMS, in which the impedance decreased with the frequency. The numerical simulations indicated that an increase in the strength of the applied electric field significantly enhanced the performance of focusing. The preliminary experiments employing latex particles with 10 μm in diameter were conducted to demonstrate the feasibility of the present design. The usage of contactless DEP technique makes the insulator-based dielectrophoretic microchip mechanically robust and chemically inert. Furthermore, the voltage applied was also reduced rather than conventional iDEP microchip.
| 原文 | English |
|---|---|
| 主出版物標題 | DTIP 2011 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS |
| 頁面 | 362-365 |
| 頁數 | 4 |
| 出版狀態 | Published - 2011 十二月 1 |
| 事件 | 2011 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2011 - Aix-en-Provence, France 持續時間: 2011 五月 11 → 2011 五月 13 |
出版系列
| 名字 | DTIP 2011 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS |
|---|
Other
| Other | 2011 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2011 |
|---|---|
| 國家 | France |
| 城市 | Aix-en-Provence |
| 期間 | 11-05-11 → 11-05-13 |
指紋
All Science Journal Classification (ASJC) codes
- Hardware and Architecture
引用此文
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Particle focusing in a contactless dielectrophoretic microfluidic chip with insulating structures. / Jen, Chun Ping; Shih, Hsin Yuan; Lee, Yung-Chun; Hsiao, Fei Bin.
DTIP 2011 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. 2011. p. 362-365 6107979 (DTIP 2011 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS).研究成果: Conference contribution
TY - GEN
T1 - Particle focusing in a contactless dielectrophoretic microfluidic chip with insulating structures
AU - Jen, Chun Ping
AU - Shih, Hsin Yuan
AU - Lee, Yung-Chun
AU - Hsiao, Fei Bin
PY - 2011/12/1
Y1 - 2011/12/1
N2 - The main purpose of the present study was to investigate the feasibility of applying the technique of contactless dielectrophoresis (cDEP) on an insulator-based dielectrophoretic (iDEP) microdevice with effective focusing of particles. The particles were introduced into the microchannel and pre-confined hydrodynamically by the funnel-shaped insulating structures close to the inlet. The particles were, therefore, repelled toward the center of the microchannel by the negative dielectrophoretic forces generated by the insulating structures. The microchip was fabricated by the technique of cDEP. The electric field in the main microchannel was generated by using electrodes inserted into two conductive micro-reservoirs, which were separated from the main microchannel by thin insulating barriers made of 20 μm-width of PDMS. The impedance of the PDMS barrier under different frequencies was measured by an impedance analyzer and the fitting curve to experimental data using the least-squares method were also addressed. The results revealed the capacitive behavior of the PDMS, in which the impedance decreased with the frequency. The numerical simulations indicated that an increase in the strength of the applied electric field significantly enhanced the performance of focusing. The preliminary experiments employing latex particles with 10 μm in diameter were conducted to demonstrate the feasibility of the present design. The usage of contactless DEP technique makes the insulator-based dielectrophoretic microchip mechanically robust and chemically inert. Furthermore, the voltage applied was also reduced rather than conventional iDEP microchip.
AB - The main purpose of the present study was to investigate the feasibility of applying the technique of contactless dielectrophoresis (cDEP) on an insulator-based dielectrophoretic (iDEP) microdevice with effective focusing of particles. The particles were introduced into the microchannel and pre-confined hydrodynamically by the funnel-shaped insulating structures close to the inlet. The particles were, therefore, repelled toward the center of the microchannel by the negative dielectrophoretic forces generated by the insulating structures. The microchip was fabricated by the technique of cDEP. The electric field in the main microchannel was generated by using electrodes inserted into two conductive micro-reservoirs, which were separated from the main microchannel by thin insulating barriers made of 20 μm-width of PDMS. The impedance of the PDMS barrier under different frequencies was measured by an impedance analyzer and the fitting curve to experimental data using the least-squares method were also addressed. The results revealed the capacitive behavior of the PDMS, in which the impedance decreased with the frequency. The numerical simulations indicated that an increase in the strength of the applied electric field significantly enhanced the performance of focusing. The preliminary experiments employing latex particles with 10 μm in diameter were conducted to demonstrate the feasibility of the present design. The usage of contactless DEP technique makes the insulator-based dielectrophoretic microchip mechanically robust and chemically inert. Furthermore, the voltage applied was also reduced rather than conventional iDEP microchip.
UR - http://www.scopus.com/inward/record.url?scp=84881075342&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84881075342&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84881075342
SN - 9782355000133
T3 - DTIP 2011 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
SP - 362
EP - 365
BT - DTIP 2011 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
ER -