TY - JOUR

T1 - Path-independent H-integral for interface corners under thermal loadings

AU - Hwu, Chyanbin

AU - Kuo, Tai Liang

AU - Huang, Chun Chih

PY - 2011

Y1 - 2011

N2 - It is well known that the path-independent H-integral is an appropriate tool for calculating the mixed mode stress intensity factors for the interface corners between dissimilar elastic materials. To extend the applicability of the H-integral from the mechanical loading condition to the thermal loading condition, a modified H-integral is proposed in this paper. This modified H-integral possesses an extra domain integral which needs the input of temperature field. Moreover, this domain integral contains singular functions that come from the strain components of the auxiliary system, and a special treatment should be made for the accurate computation of stress intensity factors. The near-tip solutions and auxiliary solutions of displacements, stresses, and temperature required in the calculation of H-integral are all provided in this paper. The validity and versatility of the proposed approach are then shown by carrying out several numerical examples such as cracks under mixed-mode thermal loadings, interface cracks/corners under uniform heat flow or uniform temperature change, and an electronic package, in which the chip has a heat generation rate, placed at a constant temperature ambiance.

AB - It is well known that the path-independent H-integral is an appropriate tool for calculating the mixed mode stress intensity factors for the interface corners between dissimilar elastic materials. To extend the applicability of the H-integral from the mechanical loading condition to the thermal loading condition, a modified H-integral is proposed in this paper. This modified H-integral possesses an extra domain integral which needs the input of temperature field. Moreover, this domain integral contains singular functions that come from the strain components of the auxiliary system, and a special treatment should be made for the accurate computation of stress intensity factors. The near-tip solutions and auxiliary solutions of displacements, stresses, and temperature required in the calculation of H-integral are all provided in this paper. The validity and versatility of the proposed approach are then shown by carrying out several numerical examples such as cracks under mixed-mode thermal loadings, interface cracks/corners under uniform heat flow or uniform temperature change, and an electronic package, in which the chip has a heat generation rate, placed at a constant temperature ambiance.

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U2 - 10.2140/jomms.2011.6.231

DO - 10.2140/jomms.2011.6.231

M3 - Article

AN - SCOPUS:79960522495

VL - 6

SP - 231

EP - 248

JO - Journal of Mechanics of Materials and Structures

JF - Journal of Mechanics of Materials and Structures

SN - 1559-3959

IS - 1-4

ER -