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Perspective of tunnel-FET for future low-power technology nodes

  • A. S. Verhulst
  • , D. Verreck
  • , Q. Smets
  • , K. H. Kao
  • , M. Van De Put
  • , R. Rooyackers
  • , B. Sorée
  • , A. Vandooren
  • , K. De Meyer
  • , G. Groeseneken
  • , M. M. Heyns
  • , A. Mocuta
  • , N. Collaert
  • , A. V.Y. Thean

研究成果: Conference contribution

15   !!Link opens in a new tab 引文 斯高帕斯(Scopus)

摘要

Theoretically, confined heterostructure p(-n)-i-n (n(-p)-i-p) TFETs are promising candidates for future low-power applications, with n-TFET outperforming p-TFET. An optimal body thickness of about 10nm is predicted for Ga0.5As0.5Sb-In0.53Ga0.47As n-TFET with I60=20μA/μm. For p-TFETs, stronger confinement may be required to avoid tunneling to the heavy-hole band. An unexploited domain is the insertion of thin heterostructure slabs offering a locally reduced dielectric constant, enhancing both SS and Ion.

原文English
主出版物標題2014 IEEE International Electron Devices Meeting, IEDM 2014
發行者Institute of Electrical and Electronics Engineers Inc.
頁面30.2.1-30.2.4
版本February
ISBN(電子)9781479980017
DOIs
出版狀態Published - 2015 2月 20
事件2014 60th IEEE International Electron Devices Meeting, IEDM 2014 - San Francisco, United States
持續時間: 2014 12月 152014 12月 17

出版系列

名字Technical Digest - International Electron Devices Meeting, IEDM
號碼February
2015-February
ISSN(列印)0163-1918

Other

Other2014 60th IEEE International Electron Devices Meeting, IEDM 2014
國家/地區United States
城市San Francisco
期間14-12-1514-12-17

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 凝聚態物理學
  • 電氣與電子工程
  • 材料化學

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