Phase Diagrams and Their Applications in Pb-Free Soldering

Sinn wen Chen, Hsin jay Wu, Wojciech Gierlotka, Shih kang Lin

研究成果: Chapter

1 引文 斯高帕斯(Scopus)

摘要

Pb-free soldering is one of the most important technologies in the electronics industry. A phase diagram is a comprehensive representation of thermodynamic properties of a multicomponent material system. Basic knowledge and information of phase diagrams of Pb-free solder systems are reviewed. In this chapter, several examples of applications of phase diagrams in Pb-free soldering are presented, including general applications of melting, solidification and intermetallic compounds (IMC) formation caused by interfacial reactions. With the aid of phase diagrams, interpretations of some abnormal phenomena in Pb-free soldering such as effective undercooling reduction by Co doping, unexpected IMC growth rate in Sn-Bi/Fe couples, unexpected solder melting in Sn-Sb/Ag joints, special up-hill diffusion in the Cu/Sn-Cu/Ni sandwich structure, and the influence of limited Sn supply upon the interfacial reactions in the Au/Sn/Cu sandwich specimens, and so on, will be given.

原文English
主出版物標題Lead-free Solders
主出版物子標題Materials Reliability for Electronics
發行者Wiley-Blackwell
頁面12-44
頁數33
ISBN(電子)9780470971826
ISBN(列印)9781119966203
DOIs
出版狀態Published - 2012 三月 15

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Materials Science(all)

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