Phase diagrams of Pb-free solders and their related materials systems

Sinn Wen Chen, Chao Hong Wang, Shih Kang Lin, Chen Nan Chiu

研究成果: Review article同行評審

109 引文 斯高帕斯(Scopus)

摘要

Replacing Pb-Sn with Pb-free solders is one of the most important issues in the electronic industry. Melting, dissolution, solidification and interfacial reactions are encountered in the soldering processes. Phase diagrams contain equilibrium phase information and are important for the understanding and prediction of phase transformation and reactive phase formation at the solder joints. This study reviews the available phase diagrams of the promising Pb-free solders, and their related materials systems. The solders are Sn-Ag, Sn-Cu, Sn-Ag-Cu, Sn-Zn, Sn-Bi, Sn-In and Sn-Sb. The materials systems are the solders with the Ag, Au, Cu, Ni substrates, such as Sn-Ag-Au, Sn-Ag-Ni, Sn-Cu-Au, and Sn-Cu-Ni ternary systems. For the Pb-free solders and their related ternary and quaternary systems, preliminary phase equilibria information is available; however, complete and reliable phase diagrams over the entire compositional and temperature ranges of soldering interests are lacking.

原文English
頁(從 - 到)19-37
頁數19
期刊Journal of Materials Science: Materials in Electronics
18
發行號1-3
DOIs
出版狀態Published - 2007 3月

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 原子與分子物理與光學
  • 凝聚態物理學
  • 電氣與電子工程

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