Phase transformation and microstructural evolution in solder joints

Sinn Wen Chen; Chao Hong Wang; Shih Kang Lin; Chen Nan Chiu; Chih Chi Chen

doi:10.1007/s11837-007-0008-5

Phase transformation and microstructural evolution in solder joints

Sinn Wen Chen, Chao Hong Wang, Shih Kang Lin, Chen Nan Chiu, Chih Chi Chen

材料科學及工程學系

研究成果: Review article › 同行評審

14 引文斯高帕斯（Scopus）

摘要

Soldering is the most important of joining technologies and there are numerous solder joints in modern electronic products. The phases and microstructures of solder joints are critical to their properties. Various remarkable phenomena caused by phase transformation and microstructural evolution in solder joints have been reported. The phenomena include ripening, layer detachment, liquation, cruciform pattern formation, solid-state amorphization, alternating layer formation, shift of reaction paths, and the effects of electromigration.

原文	English
頁（從 - 到）	39-43
頁數	5
期刊	JOM
卷	59
發行號	1
DOIs	https://doi.org/10.1007/s11837-007-0008-5
出版狀態	Published - 2007 1月

All Science Journal Classification (ASJC) codes

材料科學(全部)
工程 (全部)

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10.1007/s11837-007-0008-5

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title = "Phase transformation and microstructural evolution in solder joints",

abstract = "Soldering is the most important of joining technologies and there are numerous solder joints in modern electronic products. The phases and microstructures of solder joints are critical to their properties. Various remarkable phenomena caused by phase transformation and microstructural evolution in solder joints have been reported. The phenomena include ripening, layer detachment, liquation, cruciform pattern formation, solid-state amorphization, alternating layer formation, shift of reaction paths, and the effects of electromigration.",

author = "Chen, {Sinn Wen} and Wang, {Chao Hong} and Lin, {Shih Kang} and Chiu, {Chen Nan} and Chen, {Chih Chi}",

note = "Funding Information: The authors acknowledge the financial support of National Science Council of Taiwan (Grant NSC95-2218-E-007- 028).",

year = "2007",

month = jan,

doi = "10.1007/s11837-007-0008-5",

language = "English",

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T1 - Phase transformation and microstructural evolution in solder joints

AU - Chen, Sinn Wen

AU - Wang, Chao Hong

AU - Lin, Shih Kang

AU - Chiu, Chen Nan

AU - Chen, Chih Chi

N1 - Funding Information: The authors acknowledge the financial support of National Science Council of Taiwan (Grant NSC95-2218-E-007- 028).

PY - 2007/1

Y1 - 2007/1

N2 - Soldering is the most important of joining technologies and there are numerous solder joints in modern electronic products. The phases and microstructures of solder joints are critical to their properties. Various remarkable phenomena caused by phase transformation and microstructural evolution in solder joints have been reported. The phenomena include ripening, layer detachment, liquation, cruciform pattern formation, solid-state amorphization, alternating layer formation, shift of reaction paths, and the effects of electromigration.

AB - Soldering is the most important of joining technologies and there are numerous solder joints in modern electronic products. The phases and microstructures of solder joints are critical to their properties. Various remarkable phenomena caused by phase transformation and microstructural evolution in solder joints have been reported. The phenomena include ripening, layer detachment, liquation, cruciform pattern formation, solid-state amorphization, alternating layer formation, shift of reaction paths, and the effects of electromigration.

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DO - 10.1007/s11837-007-0008-5

M3 - Review article

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SN - 1047-4838

VL - 59

SP - 39

EP - 43

JO - JOM

JF - JOM

IS - 1

ER -

Phase transformation and microstructural evolution in solder joints

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